100-008-000
CONN IC DIP SOCKET 8POS GOLD
100-008-000 Specifications
Part Status：
Obsolete
Mounting Type：
Through Hole
Pitch - Mating：
0.100" (2.54mm)
Contact Finish - Mating：
Gold
Pitch - Post：
0.100" (2.54mm)
Contact Resistance：
-
Material Flammability Rating：
UL94 V-0
Termination：
Solder
Type：
DIP, 0.3" (7.62mm) Row Spacing
Contact Material - Mating：
Beryllium Copper
Features：
Open Frame
Contact Finish - Post：
Gold
Contact Material - Post：
Brass
Number of Positions or Pins (Grid)：
8 (2 x 4)
Current Rating (Amps)：
1 A
Housing Material：
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature：
-65°C ~ 125°C
Contact Finish Thickness - Post：
Flash
Contact Finish Thickness - Mating：
8.00µin (0.203µm)
Termination Post Length：
0.126" (3.20mm)
